DC/DC Buck Circuit “Ground Bounce” Principle and Solution

2024-11-20 11:27:28 1422

In electronic design, DC/DC step-down circuits are a common type of circuit used to convert higher DC voltages to lower DC voltages. However, this type of circuit often encounters a tricky problem during operation - Ground Bounce. Ground bounce, also known as ground bounce, is a transient voltage fluctuation at the ground node caused by a rapid change in current. This phenomenon not only affects the performance of the circuit, but also may produce electromagnetic interference (EMI), thus affecting the stability and reliability of the entire system.

 

I. The principle of ground bounce

The root cause of ground bounce lies in the basic principles of electromagnetic fields. When the current flows through a wire loop, it will produce a magnetic field around it, the size of which is proportional to the current. According to Faraday's Law of Electromagnetic Induction, when the magnetic field varies, it produces an electromotive force, or voltage, in the loop. Specifically, the rate of change of the magnetic flux (ΦB) is proportional to the voltage generated (ε), i.e., ε = -N * dΦB/dt, where N is the number of turns in the coil.

In DC/DC step-down type circuits, fast switching of switching devices (e.g., MOSFETs) results in rapid changes in current. This change generates a voltage across the loop inductance, which causes transient voltage fluctuations, known as ground bounce, at the ground node. For example, when the switch is disconnected, the flux in the loop through which the current is flowing changes from a non-zero value to zero, which creates a reverse voltage spike across the conductor, especially if a portion of the conductor is ground-connected. This voltage spike can reach several volts, negatively affecting other parts of the circuitry that depend on a stable ground reference, which can lead to logic errors or false triggers.

 

II. Effects of Ground Bounce

The impact of ground bounce on DC/DC step-down circuits is multifaceted. First, it can lead to unstable system performance because voltage fluctuations at the ground node can interfere with the normal operation of the circuit. Second, ground bounce also generates electromagnetic interference (EMI), which not only affects the performance of the circuit itself, but can also cause interference with other electronic devices. In addition, ground bounce can cause logic errors or false triggers, leading to unreliable system operation.

 

III. Solutions

In order to effectively reduce ground bounce in DC/DC step-down circuits, the following measures can be taken:

Reduce the loop area

Reducing the loop area of the current path reduces the flux variation and thus reduces ground bounce. In the PCB layout, the current path should be made as short and straight as possible to avoid large loop areas. This can be achieved by optimizing the circuit layout and wiring.

Add decoupling capacitors

Placing decoupling capacitors at critical locations, especially between power and ground, can quickly absorb transient currents generated by ground bounce and reduce voltage fluctuations. The selection of decoupling capacitors should be based on the specific needs of the circuit and the characteristics of the capacitors.

Use of Multiple Ground Points

The use of multiple grounding layers or planes on a PCB, connected by appropriate vias, spreads out the current path and reduces voltage variations at a single point of grounding. This approach helps minimize the impact of ground bounce on circuit performance.

Optimizing the Layout of Switching Devices

Place switching devices and associated filter capacitors as close together as possible to shorten the current path and reduce loop area. This helps to reduce the rate of change of magnetic flux, which in turn reduces ground bounce.

Use low ESR capacitors

Selecting capacitors with low equivalent series resistance (ESR) can better cope with transient current variations and reduce voltage fluctuations. Low ESR capacitors offer faster response and better stability, helping to reduce ground bounce.

Consider Time Constants

Consider the time constant of the circuit when designing to ensure that the capacitance is large enough to respond quickly to current changes. This helps maintain circuit stability and reduce ground bounce.

 

IV. Considerations for Practical Applications

In practical application, the following points should also be noted:

When designing circuits, the impact of ground bounce should be fully considered and appropriate measures should be taken to prevent it.

In PCB layout and wiring, best practices should be followed to ensure that the current path is short and straight, avoiding large loop areas.

When selecting capacitors, comprehensive consideration should be given to the specific needs of the circuit and the characteristics of the capacitors to select the most appropriate capacitor type and specification.

When testing the circuit, suitable test equipment and methods should be used to monitor and evaluate the ground bounce to ensure the performance and stability of the circuit.

 

V. Conclusion

Ground bounce is a common and important problem in DC/DC buck-type circuits. Its impact on circuit performance and stability can be significantly reduced through a thorough understanding of the principles and effects of ground bounce, and by adopting effective solutions. In practice, attention also needs to be paid to the details of circuit design and the choice of test methods to ensure the performance and reliability of the circuit. Through continuous learning and practice, we can better navigate the ground bounce problem in DC/DC buck-type circuits to provide strong support for the design and production of electronic devices.

Tags:

Share

Related News more>

Elliptic Labs' AI platform optimized for Ceva NeuPro-Nano NPU to enable smarter edge devices
Elliptic Labs, a global leader in AI software with over 500 million AI Virtual Smart Sensors™ deployed in devices, and Ceva, a leading global semiconductor product and software IP licensing company that helps smart edge devices connect, sense, and infer data more reliably and efficiently, have announced a collaboration to bring Elliptic Labs' AI Virtual Smart Sensor Platform™ to Ceva's cutting-edge NeuPro-Nano neural processing unit (NPU). perceive, and infer data, Ceva, a global leader in semic....
EP2C20F484I8N FPGAs: Features, Applications and Datasheet
EP2C20F484I8N Description The EP2C20F484I8N is a high-performance, low-power Cyclone® II FPGA housed in a 484-pin FineLine BGA package. Built on a 90 nm process node, this device provides an optimal balance of cost-efficiency and logic density, making it ideal for complex programmable logic designs in cost-sensitive embedded applications. Its I-temperature rating (industrial) ensures reliable operation across extended temperature ranges. EP2C20F484I8N Features Logic Elements (LEs): 20,060 LEs for exte....
How to Accurately Measure Power Supply Ripple Noise: Probe Selection, Grounding, and Bandwidth Tips
A user was testing the ripple of a 5V signal output from a switching power supply using an oscilloscope with a 500MHz bandwidth. They found that the peak-to-peak value of the ripple and noise reached over 900mV (as shown in the figure below), while the switching power supply's specified peak-to-peak ripple value was
IAR Development Platform Upgrades Arm and RISC-V Development Toolchains to Accelerate Modern Embedded System Development
Uppsala, Sweden, June 10, 2025 — IAR, a global leader in embedded software solutions, has officially released major updates to its flagship products: Arm Development Toolchain v9.70 and RISC-V Development Toolchain v3.40. These updates significantly enhance the IAR Development Platform's capabilities in performance, security, and automation, enabling agile and scalable embedded applications across industries such as automotive, industrial, medical, and IoT. Figure 1 To address the growing complexity ....