67B3G3006010010R0C
detaildesc

67B3G3006010010R0C

Laird Technologies EMI

Product No:

67B3G3006010010R0C

Package:

-

Batch:

-

Datasheet:

pdf

Description:

SP,CON,AU,TNR 10X3X6MM

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

In Stock : Please Inquiry

Update Time: -

Please send RFQ , we will respond immediately.

Product Information

Parameter Info

Product Details

User Guide

Mfr Laird Technologies EMI
Type Fingerstock
Shape -
Width 0.119" (3.00mm)
Height 0.394" (10.00mm)
Length 0.236" (6.00mm)
Series B3G
Package Bulk
Plating Gold
Material Beryllium Copper
Shelf Life 12 Months
Product Status Active
Shelf Life Start -
Attachment Method Solder
Plating - Thickness -
Operating Temperature -
Storage/Refrigeration Temperature 50°F ~ 77°F (10°C ~ 25°C)