FI-XPB30SL-HF10-R3000
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FI-XPB30SL-HF10-R3000

JAE Electronics

Product No:

FI-XPB30SL-HF10-R3000

Manufacturer:

JAE Electronics

Package:

-

Batch:

-

Datasheet:

-

Description:

CONN RCPT 30P 0.039 GOLD SMD R/A

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

Product Details

User Guide

Mfr JAE Electronics
Style Board to Cable/Wire
Series FI-XP
Package Tape & Reel (TR)
Features Grounding Pins, Shielded, Solder Retention
Termination Solder
Applications -
Contact Type Non-Gendered
Contact Shape -
Mounting Type Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle
Connector Type Receptacle
Fastening Type Friction Lock
Number of Rows 1
Pitch - Mating 0.039" (1.00mm)
Product Status Obsolete
Voltage Rating -
Contact Material Copper Alloy
Insulation Color Beige
Insulation Height -
Ingress Protection -
Base Product Number FI-XPB30
Insulation Material Plastic
Number of Positions 30
Row Spacing - Mating -
Contact Finish - Post Tin
Contact Length - Post -
Current Rating (Amps) -
Operating Temperature -
Mated Stacking Heights -
Contact Finish - Mating Gold
Number of Positions Loaded All
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 12.0µin (0.30µm)