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HSB16-404018
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HSB16-404018

CUI Devices

Product No:

HSB16-404018

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

pdf

Description:

HEAT SINK, BGA, 40 X 40 X 18 MM

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : 978

Update Time: 2024-07-19 17:47:32

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2.1185

    $2.1185

  • 10

    $2.06245

    $20.6245

  • 25

    $2.00678

    $50.1695

  • 50

    $1.89544

    $94.772

  • 100

    $1.78391

    $178.391

  • 250

    $1.672418

    $418.1045

  • 500

    $1.616653

    $808.3265

  • 1000

    $1.449424

    $1449.424

  • 5000

    $1.421552

    $7107.76

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Product Information

Parameter Info

Product Details

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.575" (40.00mm)
Length 1.575" (40.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.709" (18.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 7.96°C/W
Power Dissipation @ Temperature Rise 9.4W @ 75°C
Thermal Resistance @ Forced Air Flow 2.60°C/W @ 200 LFM