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HSB28-606022
CUI Devices
Product No:
HSB28-606022
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 60 X 60 X 22 MM,
Quantity:
Delivery:
Payment:
In Stock : 79 
Update Time: 2024-07-19 17:47:33
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$6.2985
$6.2985
10
$6.09235
$60.9235
25
$5.91584
$147.896
50
$5.56377
$278.1885
100
$5.000325
$500.0325
250
$4.929892
$1232.473
500
$4.612991
$2306.4955
1000
$4.542558
$4542.558
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Product Information
Parameter Info
Product Details
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 2.362" (60.00mm) |
| Length | 2.362" (60.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.866" (22.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Push Pin |
| Thermal Resistance @ Natural | 4.74°C/W |
| Power Dissipation @ Temperature Rise | 15.83W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 1.40°C/W @ 200 LFM |
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